Chip-On-Flex refers to the semiconductor assembly technology in which the die or microchip are directly mounted on the flexible substrate circuit board instead of the traditional printed circuit boards, along with electrical connections. Different types of substrates are using for Chip-On-Flex, such as rigid-flexible boards, flexible reinforced boards, and semi-flexible boards. Chip-On-Flex features several benefits over the printed circuit boards such as compact size, reduced weight, lower production cost, and high reliability.
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