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HVAC (Heating, Ventilation and Air conditioning) is the technologyof managing indoor air quality and vehicular environmentalcomfort. HVAC technology is based on the principles of thermodynamics, fluid dynamics, and heat transfer. HVAC systems are required in office and industries to control the price of cooling and heating, especially when the assembly is huge and it requires distinct temperature areas over the building and is regulated with respect to temperature and humidity by using fresh air from outdoors.
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Chip-On-Flex refers to the semiconductor assembly technology in which the die or microchip are directly mounted on the flexible substrate circuit board instead of the traditional printed circuit boards, along with electrical connections. Different types of substrates are using for Chip-On-Flex, such as rigid-flexible boards, flexible reinforced boards, and semi-flexible boards. Chip-On-Flex features several benefits over the printed circuit boards such as compact size, reduced weight, lower production cost, and high reliability.
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